Samsung Exynos heating issues could be put to rest with the Exynos 2600

Samsung is reportedly giving its next-generation Exynos 2600 processor a serious cooling upgrade. These chips have historically had a somewhat spicy reputation ahead, so Samsung appears to be making amends ahead of the 2600’s potential debut in next year’s Galaxy S26 lineup.

Exynos 2600 to come with a cooling solution

A report by Korean publication ETNews, citing industry sources, says that Samsung’s System LSI division plans to integrate what it calls a ‘Heat Pass Block’ or HPB into the chip’s architecture. This new component functions as a built-in heatsink designed to siphon heat away from the processor more efficiently.

The company is altering its chip layout to accommodate this change. Previously, mobile DRAM was stacked directly on the processor. But with this new design, we will see the HPB sit side-by-side with the DRAM. And both of these components will be mounted on top of the main logic chip using a sophisticated packaging method.

The Exynos 2600 is being manufactured on an advanced 2-nanometre process, which is a significant shrink from the 3-nanometre Exynos 2500. Sure, finer circuits allow for more transistors and thus better performance, but they also generate a proportional amount of heat. Left unchecked, that heat forces the chip to throttle its performance and erases any potential gains. The HPB is Samsung’s big bet on letting the Exynos 2600 run at full tilt without burning out.

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A lot is riding on this effort. Again, the Exynos brand has a history of struggling with performance and heat management. The recent Exynos 2500 even failed to make the cut for the flagship Galaxy S25 series.

Currently, Samsung is evaluating the new chip’s performance and final decisions are expected later this year. This could pave the way for a more powerful and stable Galaxy S26.